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Nonvolatile Memories for Hardware Security: From OTP (One-time-programming) to PUF(Physical Unclonable Function)
Nonvolatile Memories for Hardware Security: From OTP (One-time-programming) to PUF(Physical Unclonable Function)
Chair Professor Steve S. Chung, National Yang Ming Chiao Tung University (NYCU), Taiwan, https://eenctu.nctu.edu.tw/en/teacher/p1.php?num=129&page=1, Taipei, Taiwan, on behalf of Victorian IEEE Electron Devices Society (Aus) Encryption, security, functionality and identification setting become indispensable in the IoT and the upcoming 5G era for high-end consumer electronics. As a result, various SoC applications bring up increasing demands of logic memory IP in advanced technology nodes. Comparing to the stand-alone memory chips (NAND, NOR flash), the development of the specific function of memory, such as One-Time-Programming or PUF(Physical Unclonable Function), becomes more popular in terms of its simplicity based on the pure logic process. In this talk, a non-volatile OTP memory cell, using a specific dielectric breakdown, named dFuse, discovered as a third breakdown different from conventional soft-breakdown and hard-breakdown has been able to achieve high density and excellent data storage, for reliable and high-security applications. Based on the device physics, the mechanism of the dielectric breakdown will first be introduced and the origin of the breakdown will be described. Its applications which led to the further development of OTP cell design and macro chips will also be demonstrated. Further implementation as a PUF will then be demonstrated. In particular, the opportunities and challenges on the current 28nm HKMG generations and beyond will be addressed. Registration is Required and the Link - https://events.vtools.ieee.org/m/269390
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Soft Robotics for Prosthetic Devices; are we getting one-step closer to their natural counterparts?
Soft Robotics for Prosthetic Devices; are we getting one-step closer to their natural counterparts?
By Professor Gursel ALICI, University of Wollongong School of Mechanical, Materials, Mechatronic and Biomedical Engineering Applied Mechatronics and Biomedical Engineering Research (AMBER) Group ARC Center of Excellence for Electromaterials Science (ACES) Meeting URL: https://deakin.zoom.us/j/84925101587?pwd=Y3VlcGxaY0FuaUtUOW41NEtCRU9FZz09 Meeting ID: 849 2510 1587 Passcode: 69473128 Chair - IEEE SMC Victorian Chapter: Professor Saeid Nahavandi, FIEEE, FATSE Abstract: Soft robotics offers unprecedented solutions for applications involving safe interaction with humans and objects, and manipulating and grasping fragile objects, crops and similar agricultural products. Progress in soft robotics will have a significant impact especially on medical applications such as wearable robots, prosthetic devices, assistive devices, and rehabilitation devices. In this talk, we aim to update on where we are in soft robotics to build prosthetic hands with features that will bring them one-step closer to their natural counterparts. The history of prosthetic hands dates back to 202 BC. Since then, significant efforts have been dedicated to the development of prosthetic hands. The primary features of a prosthetic hand should be to receive and identify its user’s intention noninvasively, and equally importantly send sensory feedback about its “state” to its user noninvasively in order to help “restore normality” for its use—bilateral control. The communication between a prosthetic device and its user (i.e., human-machine interface) has been a challenging research problem. We will also present the progress we have made in the research theme of soft robotics for prosthetic devices and the establishment of a fully 3D printed transradial prosthetic hand at our research center, ACES, at University of Wollongong. Biography: Gursel Alici received his Ph.D. degree in Robotics from the Department of Engineering Science, Oxford University, Oxford, U.K., in 1994. He is currently a Senior Professor at the University of Wollongong, Wollongong, Australia, where he is the Head of the School of Mechanical, Materials. Mechatronic and Biomedical Engineering since 2011. His research interests are soft robotics, system dynamics and control, robotic drug delivery systems, novel actuation concepts for biomechatronic applications, robotic mechanisms and manipulation systems, soft and smart actuators and sensors, prosthetic devices, and medical robotics. He has generated more than 350-refereed publications and delivered numerous invited seminars and keynote talks on his areas of research. Dr. Alici was a Technical Editor of the IEEE/ASME Transactions on Mechatronics during 2008–2012. He was a Technical Editor of the IEEE Access, during 2013-2020. He is currently Senior Editor of the IEEE/ASME Transactions on Mechatronics, as of January 1, 2020. He has served on the international program committees of numerous IEEE/ASME International Conferences on Robotics and Mechatronics. He was the General Chair of the 2013 IEEE/ASME International Conference on Advanced Intelligent Mechatronics held in Wollongong, Australia. He is the leader of Soft Robotics for Prosthetic Devices theme of the ARC Center of Excellence for Electromaterials Science. He received the Outstanding Contributions to Teaching and Learning Award in 2010, the Vice-Chancellor’s Interdisciplinary Research Excellence Award in 2013, and Vice-Chancellor’s Award for Research Supervision in 2018 from the University of Wollongong. He has held a visiting professorship position at Swiss Federal Institute of Technology, Lausanne (EPFL) (2007, 2010), City University of Hong Kong (2014), University of Science and Technology of China (USTC) (2015), and University of British Columbia, Canada (2019).
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Nonvolatile Memories for Hardware Security: From OTP (One-time-programming) to PUF(Physical Unclonable Function)
Nonvolatile Memories for Hardware Security: From OTP (One-time-programming) to PUF(Physical Unclonable Function)
Chair Professor Steve S. Chung, National Yang Ming Chiao Tung University (NYCU), Taiwan, https://eenctu.nctu.edu.tw/en/teacher/p1.php?num=129&page=1, Taipei, Taiwan, on behalf of Victorian IEEE Electron Devices Society (Aus) Registration is Required and the Link - https://events.vtools.ieee.org/m/269390 Abstract: Encryption, security, functionality and identification setting become indispensable in the IoT and the upcoming 5G era for high-end consumer electronics. As a result, various SoC applications bring up increasing demands of logic memory IP in advanced technology nodes. Comparing to the stand-alone memory chips (NAND, NOR flash), the development of the specific function of memory, such as One-Time-Programming or PUF(Physical Unclonable Function), becomes more popular in terms of its simplicity based on the pure logic process. In this talk, a non-volatile OTP memory cell, using a specific dielectric breakdown, named dFuse, discovered as a third breakdown different from conventional soft-breakdown and hard-breakdown has been able to achieve high density and excellent data storage, for reliable and high-security applications. Based on the device physics, the mechanism of the dielectric breakdown will first be introduced and the origin of the breakdown will be described. Its applications which led to the further development of OTP cell design and macro chips will also be demonstrated. Further implementation as a PUF will then be demonstrated. In particular, the opportunities and challenges on the current 28nm HKMG generations and beyond will be addressed
The Discovery of Third Breakdown: Applications to Memories and Hardware Security
The Discovery of Third Breakdown: Applications to Memories and Hardware Security
Encryption, security, functionality and identification setting become indispensable in the IoT and the upcoming 5G era for high-end consumer electronics. As a result, various SoC applications bring up an increasing demands of logic memory IP in advanced technology nodes. Comparing to the stand-alone memory chips (NAND, NOR flash), the development of specific function of memory, such as One-Time-Programming or PUF(Physical Unclonable Function), becomes more popular in terms of its simplicity based on the pure logic process. In this talk, a non-volatile OTP memory cell, using a specific dielectric breakdown, named dFuse, discovered as a third breakdown different from conventional soft-breakdown and hard-breakdown has been able to achieve high density and excellent data storage, for reliable and high-security applications. Based on the device physics, the mechanism of the dielectric breakdown will first be introduced and the origin of the breakdown will be described. For hardware security purposes, the first application as an OTP memory will be demonstrated. Further implementation as a PUF for hardware security will then be demonstrated. Biography STEVE CHUNG received his PhD degree from the University of Illinois at Urbana-Champaign, in Electrical Engineering. Currently, he is a Chair Professor and UMC Research Chair Professor at the National Yang Ming Chiao Tung University (NYCU). He was a visiting professor with Stanford University (2001, 2009), University of California-Merced (2009-2010), giving course lectures at both universities in the Fall of 2009. He has also been a consultant of the two worlds largest IC foundries, TSMC and UMC. His current research areas include- Nanoscale CMOS device physics and technology; flash memory technology and reliability; and reliability physics and interface characterization, In-memory Computing for AI. He has published more than 300 journal and conference papers, one textbook, and holds about 40 patents. Since 1995, he presented more than 30 times in the world-leading IEEE conferences, IEDM and VLSI. In particular, he is the first (from Taiwan) to present the paper at VLSI Technology symposium in 1995. He is an IEEE Fellow, a distinguished Lecturer of IEEE, and has ever served as Board of Governor of EDS for 12 years. Prior involvements include EDS Regions/Chapters Vice-Chair/Chair, and Editor of J-EDS, Editor of EDL. He has served in the TPC of premiere conferences, e.g., VLSI Technology, IEDM, IRPS, SNW, VLSI-TSA etc. Among numerous award he received includes 3 times outstanding research awards, distinguished PI, and distinguished NSC Research Fellow, from the National Science Council; Pan Wen Yuan award in recognizing his outstanding achievements in the semiconductor research; a Lifetime Achievement Award of National Inventors. He was also granted Distinguished EE Professor and Engineering Professor by the Engineering Societies of Taiwan. Registration Link https://events.vtools.ieee.org/m/269390
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GHz Bandwidth Sensing by Sub-Nyquist Signal Processing
GHz Bandwidth Sensing by Sub-Nyquist Signal Processing
IEEE VTS Chapter talk by Prof. Yue Gao, VTS Distinguished Lecturer and Professor and the Chair of Wireless Communications at the University of Surrey, United Kingdom. This talk will present a new approach to design GHz bandwidth sensing (GBSense) systems to overcome Nyquist-rate sampling's bottleneck by developing sub-Nyquist sampling algorithms repurposing the existing expertise of intelligent antennas and reconfigurable transmission lines. The registration link is https://events.vtools.ieee.org/m/269721 For further information contact Enn Vinnal ([email protected])
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Digital Transformation
Digital Transformation
By Professor Okyay Kaynak, FIEEE, IEEE Distinguished Lecturer UNESCO Chair on Mechatronics, Bogazici University, Turkey Meeting Link: https://deakin.zoom.us/j/86356005392?pwd=ZnBNWENlelRrQVFMV1FFUG5QbGttUT09 Meeting ID: 863 5600 5392 Password: 42856716 Find your local number: https://deakin.zoom.us/u/knsbQRbvW Join by SIP [email protected] Join by Skype for Business https://deakin.zoom.us/skype/86356005392 Chair - IEEE SMC Victorian Chapter: Professor Saeid Nahavandi, FIEEE, FATSE Abstract: This presentation discusses the profound technological changes that have taken place around us during the last two decades, supported by the new disruptive advances both on the software and the hardware sides, as well as the cross-fertilization of concepts and the amalgamation of information, communication and control technology driven approaches. In recent years, in an attempt to change the whole format of industrial automation, these developments have been taken further, especially in Germany, under the label “Industry 4.0”. The dominant feature of Industry 4.0 is the integration of the virtual world with the physical world through the Internet of Things (IoT). Such engineered systems are named Cyber Physical Systems built from, and depends upon, the seamless integration of computational algorithms and physical components. A more comprehensive description of what is happening around us is the digital transformation. After reviewing these profound changes, the presentation is concluded with a discussion of the integration of AI in digital transformation in various forms and a preview of Industry 5.0. Biography: Okyay Kaynak received the B.Sc. degree with first class honors and Ph.D. degrees in electronic and electrical engineering from the University of Birmingham, UK, in 1969 and 1972 respectively. From 1972 to 1979, he held various positions within the industry. In 1979, he joined the Department of Electrical and Electronics Engineering, Bogazici University, Istanbul, Turkey, where he is currently a Professor Emeritus, holding the UNESCO Chair on Mechatronics. He is also a 1000 People Plan Professor at University of Science & Technology Beijing, China. He has hold long-term (near to or more than a year) Visiting Professor/Scholar positions at various institutions in Japan, Germany, U.S., Singapore and China. His current research interests are in the broad field of intelligent systems. He has authored three books, edited five and authored or co-authored more than 450 papers that have appeared in various journals and conference proceedings. Dr. Kaynak has served as the Editor in Chief of IEEE Trans. on Industrial Informatics and IEEE/ASME Trans. on Mechatronics as well as Co-Editor in Chief of IEEE Trans. on Industrial Electronics. Additionally, he is on the Editorial or Advisory Boards of a number of scholarly journals. He received the Chinese Government’s Friendship Award and Humboldt Research Prize (both in 2016). Most recently, in 2020, he was awarded the Academy Prize of Turkish Academy of Sciences.
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