3rd IEEE Electron Devices Kolkata Conference (EDKCON 2024)

Venue: Science City, Kolkata, West Bengal, India

Organized by: IEEE EDS Kolkata Chapter

Date: 23rd – 24th November 2024

Previous EDKCON Conferences:

1. 1st IEEE International Conference EDKCON 2018  EDKCON 2018 Proceeding in IEEE Xplore

2. 2nd IEEE International Conference EDKCON 2022  EDKCON 2022 Proceeding in IEEE Xplore


Last date for paper submission: 15th July 2024
Date for acceptance: 30th September 2024
Registration deadline: 15th October 2024
Camera-ready paper submission: 10th November 2024
Conference dates: 23rd – 24th November 2024



General Information

The 2024 IEEE Electron Device Kolkata Conference (2024 IEEE EDKCON) will be held in Kolkata, India. The conference will be organized by IEEE EDS Kolkata Chapter. It is expected that that the premier conference will be a global hub of exchanging ideas between researchers, educators, students from across academia, government, industry, and non-governmental organizations to discuss, share and promote cutting-edge technological developments and accomplishments across all aspects of Electron Devices, Circuits and Systems. Original unpublished papers are solicited.

Accepted and presented papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements

Call for Papers

Extended versions of papers will be submitted for possible inclusion of journals and book chapters

Topics of Interests but not limited to

Track 1: Emerging Devices and Technology (EDT)

Track-2: Analog/Digital/ Mixed Mode Circuits and Systems (ADM-CS)

Track 3: Memory Devices and Technology (MDT)

Track-4: Device Modeling and Simulations (DMS)

Track 5: Nano-electronic Devices and Technology (NDT)

Track 6: Advance Processing and characterizations (APC)

Track 7: Device and System Reliability (DSR)

Track 8: Optoelectronics, Displays and Imagers (ODI)

Track 9: Sensor and MEMS (SEM)

Track 10: Intelligent Electronic Device, Circuit, and System (IDCS)


Track Details
Name of the Track Details of the Track
Track 1: Emerging Devices and Technology (EDT) Biodegradable and Flexible Electronic Devices; Electron Devices for “More than Moore”, 2D and devices on low-dimensional materials, Neuromorphic and approximate computing devices, Spintronic and magnetic devices, Steep-slope devices, Quantum computing devices, Cryogenic Devices, Topological materials and devices, and phase transitions transistors, Compound Semiconductors and High-Speed Devices, Wearable electronics. Wide bandgap and ultra-wide bandgap semiconductors, Power devices, High Performance III-V, III-Nitride and Si, SiGe devices for mm-wave to THz.Device and circuits for 5G and 6G, Power device technologies for micro and mm-wave
Track-2: Analog/Digital/ Mixed Mode Circuits and Systems (ADM-CS) Analog and Mixed Signal Circuits and Systems, Communications Circuits and Systems, Sensory Circuits and Systems, Nonlinear Systems and Circuit Theory, Visual Signal Processing and Communications Education in Circuits and Systems, Beyond CMOS: Nanoelectronics and Hybrid Systems Integration Digital Integrated Circuits and Systems, Power and Energy Circuits and Systems, Biomedical Circuits and Systems Neural Networks and Neuromorphic Engineering, Digital Signal Processing, Multimedia Systems and Applications, Low power circuits and system, high speed circuits and systems. Control electronics for Quantum Computing
Track 3: Memory Devices and Technology (MDT) 3D memory technologies, Conventional memories, Emerging memories for neural networks and AI/ML applications, Computing-in-memory, new memory hierarchy
Track-4: Device Modeling and Simulations (DMS) Multiscale simulation with hybrid techniques, TCAD and benchmarking, Atomistic simulation, Compact models for device/system technology co-optimizations, Alternative computing device modeling, modeling of emerging devices, Material and interconnect modeling, Advanced packaging and 3D integration modeling, Device modeling for photonics, sensor computing, RF device and circuits, and MEMS
Track 5: Nano-electronic Devices and Technology (NDT) Novel nanomaterials and devices, Nanobiotechnology, Nanomaterials for energy conversion, Green nanotechnology, Nano Mechanics, Carbon Nanotubes emitters, Biological applications of nanoparticles, Nano Fabrication and Metrology, Nano Heat Transfer and Energy Information Technology, Nano Sensors, Actuators and Systems Nanobionics, Nanofluidics and Bio Chips, Organic Electronics, nanowires and nanosheets
Track 6: Advance Processing and characterizations Advanced process integration schemes and (applications-driven) scaling approaches, Device/System technology co-optimization, monolithic 3D integration, heterogenous chiplets, 2.5/3D integration, Interconnects (TSV, BEOL, Frontside and Backside connectivity), BEOL compatible transistors, CMOS platform technologies & opportunities
Track 7: Device and System Reliability (DSR) Reliability of devices and systems for biomedical, automotive, and aerospace, Reliability of FEOL/MEOL/BEOL, latch‐up and ESD, Design for reliability and variability-aware design, Robustness and security of electronic circuits and systems, Reliability of cryogenic devices for future quantum computing applications, Noise characterization of device and system, Reliability of biomedical devices, circuits and systems, Degradation mechanisms of emerging memories, Reliability of devices, circuits, and systems for more-than-Moore, reliability of power devices
Track 8: Optoelectronic Devices and circuits, Displays and Imagers (ODI) Topological optoelectronics and photonics, Optoelectronic integration, Heterogeneous optoelectronic integration, Single-photon devices, Holographic devices and displays, Luminescent devices-based perovskites and quantum dots, Intelligent Image Sensors, PV systems, Solar cells, Displays, and imagers for augmented or virtual reality, Imagers with an unconventional spectral bandwidth, high sensitivity, or high time-resolution
Track 9: Sensor and MEMS (SEM) Bio-sensor, ISFET, Ph Sensor, gas sensors, Flexible devices for wearable applications, Intelligent sensors with embedded AI/ML, Sensors and devices for human-machine interface, MEMS for Internet of Things, Bio-electronic interfaces and implantable devices, Energy harvesting and storage devices, Flexible devices for wearable applications
Track 10: Intelligent Electronic Device, Circuit, and System (IDCS) Devices/ Circuits/systems/ Tools/Platforms for AI, Artificial intelligence computing, Advanced neural network design, Neuromorphic processors, Deep learning algorithms, ML algorithms, Hardware accelerators, Hardware design for AI, Emerging applications of AI


A. Steering Committee

B. Executive Committee

C. International Advisory Committee